JPH0317237B2 - - Google Patents
Info
- Publication number
- JPH0317237B2 JPH0317237B2 JP22678883A JP22678883A JPH0317237B2 JP H0317237 B2 JPH0317237 B2 JP H0317237B2 JP 22678883 A JP22678883 A JP 22678883A JP 22678883 A JP22678883 A JP 22678883A JP H0317237 B2 JPH0317237 B2 JP H0317237B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- hole
- layer
- conductive paint
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 111
- 238000007747 plating Methods 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 50
- 230000001070 adhesive effect Effects 0.000 claims description 49
- 239000000853 adhesive Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 36
- 239000000126 substance Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 151
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 238000005476 soldering Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000008602 contraction Effects 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22678883A JPS60119795A (ja) | 1983-12-02 | 1983-12-02 | 電子回路用基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22678883A JPS60119795A (ja) | 1983-12-02 | 1983-12-02 | 電子回路用基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60119795A JPS60119795A (ja) | 1985-06-27 |
| JPH0317237B2 true JPH0317237B2 (en]) | 1991-03-07 |
Family
ID=16850620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22678883A Granted JPS60119795A (ja) | 1983-12-02 | 1983-12-02 | 電子回路用基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119795A (en]) |
-
1983
- 1983-12-02 JP JP22678883A patent/JPS60119795A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60119795A (ja) | 1985-06-27 |
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